So the idea is to take components that are often separate on a system – processors, main memory, networking and other peripherals – and etch them all onto chips and then stack them up in a 3D array, rather than solder them onto a motherboard and wire them together with metal stripes in a 2D array. By going 3D, the wires between components can not only be shortened - cutting the time those components need to exchange signals and potentially requiring less energy to send a signal.

"Today's chips, including those containing 3D transistors, are in fact 2D chips that are still very flat structures," explained Bernie Meyerson, a vice president of IBM Research, in a statement announcing the partnership between Big Blue and 3M.

"Our scientists are aiming to develop materials that will allow us to package tremendous amounts of computing power into a new form factor – a silicon skyscraper. We believe we can advance the state-of-art in packaging, and create a new class of semiconductors that offer more speed and capabilities while they keep power usage low – key requirements for many manufacturers, especially for makers of tablets and smartphones."

The initial plan is to come up with a way to stack up as many as 100 chips into a tower of computing power. Over the long haul IBM wants to be able to bond stacks of complete wafers together, bonding hundreds of processors at a time.

The plan, says the IBM source, is to get it into production around the end of 2013.