1) They haven't yet put the PCB boards together at the fab house they are using. This is assuming that the fab house is in charge of integrating/assembling the entire board and not just the PCB without the ASIC chips. If this is the case, then forget about November.
2) They have assembled the PCB boards at the outsourced fab house despite not having the ASICs on hand, but lack the chips which will be done in house or sent to the outsourced Fab house once again. (Does this imply it will be done in-house with the new equipment they have on hand...can anyone see further delays as they learn how to use the equipment?)
Which it is, is anyones guess...
I would be shocked if it wasn't scenario 1. It would make no sense to completely populate the boards other than the ASICs and then tack on the ASICs as they arrive. The difference to a large board house with all the parts on hand between completely populating the bare boards vs only adding the eight chips is going to be small if it exists at all.
I agree: scenario 1 is the only possible, it's a nonsense weld all the smd components and then add another 8 smd in second time. And with the experience I've had of some other similar project there will be to expect at least 3-4 weeks from the shipment of the chips to the final assembly and testing of the PCB. So at least 5-6 weeks before it will be shipped to customer if they ship directly from the fab or 1-2 weeks more otherwise. So we are at December/January if the chips will be shipped in few days