I think that's all conjecture at this time, since there has been no official taping out etc from Tom regarding the bASIC either. It's still up in the air who will ship first right now.
Look back up at the quote I used 3 posts ago.
The ASIC's are "in fabrication" which means they have taped out and are somewhere in the mask/wafer/die making process.
Honestly I think he announced it within a week or 2 of the bASIC announcement. He held off opening things up until he had finished his prep work, and it sounded like he even had an ugly hack of a prototype at that time.
Anyone who have not taped out yet is unlikely to deliver before the end of the year, and I'm pretty sure even Avalon has already passed the tape-out mark, now that I think back.
The PCB Design and layout is independent, and much easier than the tape-out process, so it generally comes after the parts specifics are final to prevent rework (like another manufacturer is likely doing)