They've admitted to using a larger die size than their competitors.
Link? I haven't seen anything from them regarding die size, but I haven't been following too closely.
I'm also worried by their refusal to say how many chips are in the 60GH/s device. I count at least five people asking in this thread and still no answer.
Dude, he listed that information in the very first post of this thread: 110nm.
Chip Specification
Technology Summary:
TSMC 0.11- micron G process
He has previously posted that they would be using either 110nm or 130nm, but confirmed the details here.