Update
1. Our wafers are already in the slicing and packaging service. Whether we could beat everyone else in early delivering, or we have to revise and redo the wafers, will be known within the next two weeks.
An encouraging update! It means the chips at least passed the QC at the fab, and that slicing+packaging+testing is already under way. I'm hungry for more info, please return soon and fill in more blanks:
1) Recovered the ~5000 BTC from GLBSE yet? (I would like to just stop worrying about it...)
2) Did the fab really process 12 layers in 7 days, or was it simply information delay?? [Dec 05: "There are 12 layers left", Dec 12: "we are now in QC"]
3) What is the reason for deploying the second half of the chips later than the first? [Genuine question, I'm simply not smart enough that the reasons are obvious to me!]
I think I can say on behalf of all (at least many/most) stakeholders: Thanks, congrats, and keep up the great work!