Or maybe not. I just pulled a die and under it is what can be best described as an IGA (insane grid array). Let's just say it looks like a ball pitch of zero, but still bga. Maybe .1mm. But yes, the failure mode seems to be die overheats, melts solder under it, and either just shorts the +.6v lines or if very unlucky shorts the 3.3v supply to power the die's housekeeping.

Fascinating.