I'm beginning to be really curious as to what the hold up is. Proper way to do this is to plan ahead, and plan for errors also.
Has something come up?
Why was hardware ordered after chips and boards arrived?
Haven't any mechanical CAD or thermal analysis been done?
Hope your update is open and detailed. There's no need to keep any secrets at this point.
The hold up, right now, is the Chinese New Year, and possibly, your inability to read.
friedcat has already said in this thread:
1) The first batch was split in half just in case there were errors in the chip design, and the first half of the first batch has been completed, the rest of the first batch has only been manufactured half way and...
2) friedcat has given his go ahead to the chip fab to complete them
3) friedcat has tested a sample of the chips, and they passed testing with flying colors, and may even be able to be clocked much higher than originally engineered for, due to how well they came out
4) the half of the first batch has been sent to the board assembler to be surface mounted with the rest of the components
5) the Chinese New Year means nothing gets done
6) he has already chosen and mostly prepared the location the mining rigs will be setup
7) the first boards should be completed and sent to friedcat and begin mining in the first or second week of February