Will they change the PCB??

And first 5000 chips, how many ASIC can be made??

I dont thinks it wll ship so fast.

Bogart, the rest of the 6 wafers, we have been holding off on the last 5 layers for the rest of the chips to be sure we don't need to make a tweak in the metal layer due to the power issue. I think we've pretty much settled that hte power issue is NOT in the chip, but somewhere in the substrate or PCB (or if it were in the chip, it's not something that's easily and quickly fixed).

The power is still far less than any other unit, so it's not like it's something crazy or anything, but it's not 1w/GH and we're trying to locate the source of the power drain. It may require a revision of the substrate and/or the PCB.