Hi Guys,

I'm an electronics HW design engineer with around 10years exp. The company I work for has designed mil spec electronics HW including mil spec ASICs.

Prototype ASICs are usually epoxy encased. The picture could be showing a BGA type Epoxy encased ASIC, hence the rounded side. BGA devices have the pins at the bottom.
Plastic encapsulation, with sharp square edges, doesn't occur until mass production.

TH components are commonly used throughout the prototype stage. The switch to Full SMD design happens later during mass production.

The TH components near the pictured ASICs could be, as mentioned before... micro-controller based ICs.

Just my 2 cents.

Guys THIS IS A SCAM !!!

After examining the PCB in more detail, i have concluded this is a SCAM.