Each wafer only has (at best) 1100 chips. There were only 6 in the last batch. Out of those 6, 1 was used for manual testing and was therefore "burned".
I haven't seen any info on what size of wafer they are using.
300mm.
Has it been posted anywhere that they yield only 1100 chips per wafer?
That is the estimated maximum yield as revealed by Inaba. If there are any bad chips of course the yield per wafer will shrink lower than that. BFL has said they (if I recall correctly) that they find 80% yield to be within their expectations.
They must be using a fairly small wafer. It should be far more than that given the 65nm process.
Thats what BFL said. Other hardware folks have done the math and it seems to be spot on for their die size.
It's been discussed [previously] at length in this board.
That is indeed about right, although a bit on the high side, for a 300mm wafer. For some reason I thought they were using bigger wafers.