3rd attempt at mounting to reduce temps, ready for the new fans. This seems to be the approach most are taking, flat with a 1" gap underneath. This will be ventilated with the old 120mms once the new ones arrived.
Did you read this?
https://docs.google.com/document/d/1VMO3VfIBy3KIwUaaQ8XhKrSVEbXeeMEqsVhhk6Bz9io/edit?pli=1quote: "Please make it vertically placed if you could. The chips are packaged via QFN, but not all the heat are absorbed by the PCB. The back side will also become hot. And if you have no mechanical setting to lift it and have to lay it on the supporting table, please make sure that there are no heat isolation material under it."
Why did no one read what I actually posted :/ "flat with a 1" gap underneath."
The gap still traps the hot air without any ventillation.
It's easy to mount it on it's edge (again, check lightbox's comments) and you can easily create an air channel, using cardboard or plastic.
here's a crappy sketch:
https://dl.dropboxusercontent.com/u/8310142/cooling.png That was my initial config and it wasn't even close to sufficient because of the inability to force the fans onto the heatsinks. There is actually quite strong airflow underneath and the mini fans on the side blow under there. Because its quite a confined area a small amount of conventional airflow pushes all the way through as there is no where for the pressure to escape.
I can feel the flow underneath and its as strong as when it was standing. I'll check underneath temps and temps of the box walls etc after 4 hours of uptime.
