Hmm yeah I've not found the most up-to-date reference (1992) on the thermal conductivity, but here's a paper:
http://infohouse.p2ric.org/ref/27/26227.pdfCombining this with the info of alfabitcoin, it seems that conductivity of the conductive epoxy is 'high', while it is still very much lower than typical solder (SnPb or including Ag).
Roughly said;
1 Watt/mºK for conductive (silver) epoxy
30-50 Watt/mºK for SnPb solder, Ag solder would presumably be higher.
This seems to be significant to not recommend epoxy for at least the thermal via connection (base of asic chips)?
EDIT:
Quick guestimate:
Thermal difference between heatsink and chip;
Assuming 1W/mºK
Assuming 7x7mm surface
Assuming 2.5W/chip
Assuming 0.2mm epoxy compound between chip and heatsink
Delta T= (2.5/(0.7*0.7) * 0.02 / 0.01 = ~10 degrees Kelvin or Celcius
Roughly losing 10 degrees from chip to heatsink (in PCB here) is not nice... (plz check my calculations, it's late and I'm sleepy

)
Same formula for solder with 30 Watt/mºK would result in;
Delta T= (2.5/(0.7*0.7) * 0.02 / 0.30 = ~0.34 degrees Kelvin or Celcius