Thanks for that info. Their data sheets give some figures for thermal conductivity. The 10 min curing epoxy is not nearly as conductive as the 4 hour long-cure version.
10 min = 0.893 W/(mK)
4 hour = 1.75 W/(mK)
This one being more thermally conductive then their thermal adhesives.
For miners who want to pre-assemble boards and then add ASIC chips later when they arrive it may be useful to run some tests. It's a lot lower than SnAg solder (being about 50 W/(mK) ) but also a very thin layer would be used so it may have little net effect. Anyway, I don't want to side track things - it was just something I thought about.