u believe it would be as they have only just received the revised boards, as BFL said they are shipping boards out that arnt quite to the spec they wanted 'hot MOSFET' i think when they do get it sorted they will go back to the small cases and stuff
I haven't seen that they'll return to the smaller cases. I suspect there is still too much heat from the 2 ASIC chips themselves at 25-35W (some have the 2GH/s upgrade) to forgo the heatsink.