I am an engineer with a background in aerodynamics/fluids and am capable of performing Heat/CFD simulations. Is there any way I can contribute to the heat sink/dissipation design. I can't promise anything but I can try if I had more understanding of what the goals/design are.
Awesome! :-)
Quick question about watercooling:
How about building a simple aluminum "box" from 5mm aluminum, no fins or similar, and screwing the K16s on that? We could use both sides of the cooler and it would be pretty easy to build.
I guess even with a low waterstream it should cool the board enough?
Cooling the water with a big radiator and a fan, outside, 35°C outside-temp worstcase.
With a few dozen watt per 100cm² this should be a piece of cake for the actual cooler?
Your gut-feeling is enough for me now :-)
(Else we might migrate to the K16 DIY thread)
Ente
So the water is running through the inside of the "box"? The largest problem with any setup like this is making sure that there is conduction between the chips and aluminum to the water. There will be no convective cooling in this setup (such as blowing air over the chip without any heat-sink). I also wouldn't consider setting something like this up along with a radiator and fan as "easy" unless you already have this stuff around. But I would have to see a design to make sure I understand what you are talking about.
Edit: OK, I've seen a design similar to what you are talking about. So, these current designs are placing heatsinks/aluminum housing on the underside of the board... how is heat being conducted from the thermal pad on the chip, through the board, and to the heatsink/aluminum? If it is just silicon then there may be a conduction/heat-transfer issue. It seems that this QFN design isn't really made for external heat dissipation.