Not to add to the table yet, until the chip is working. The calculated value however explains much.
KnC Promised Figures Design | MH/s | Device | Process node, $\lambda$ | Area | η (H*pm/s) |
KnCMiner | 100.0GH/s | Custom | | 3025mm2 | 90.71 |
The area is package area, actual chip area will be significantly smaller, so the η value will be higher.Edit: The die area is exact (55 mm x 55 mm), the package is 90 mm x 90 mm. Source:
https://www.youtube.com/watch?v=by-je8XRCdYSecond edit: I must had misunderstood the video when I had been watching it for first time. There they stated quite clearly, the chip (the package) would be the size shown, about 60 mm x 60 mm,
not the die, which will be much smaller.
The conclusion: η should be significantly greater than 90.