I have some questions before I can accurately model the board:
1) What is the thickness of the silicon?
2) What is on the under-side of the board?
3) How are TerraHash, yourself and others expecting to transfer heat from the components, through the silicon, to the aluminum heat sinks? Thermal pads, paste?
4) What material covers the avalon chips and why can't heatsinks be attached directly to them?
5) This is only a single layer board with no trace or components on the under-side or internal layers?
1) the K16 eagle files have been posted, with the Burnin we don't know yet.
2) PCB flat with though hole pads
3) Most likely thermal
insulation interface material, silicone sheet possibly, going to see what Burnin and Bkkcoins use and/or what i can get a good price on.
4) some sort of plastic and not a good heat transfer medium, chip is designed to shed head though the base into the vias in the pcb
5) multi layer boards both