It's quite obvious the chips were desoldered, look at the state of those solder pads! Why are there no power caps or power connector installed? Also what kind of test bed is this... circuit board sitting on a sheet of paper? ever hear of ESD and what it can do to high density ASICS? Glad I didn't fall for this... Good Luck all
Yeah, the solder does not look like it's fresh at all. Does that happen (the bubbling and deformation) in a reflow oven if there aren't any ICs on the pads?