Now that there is new data on die size, I updated the GH/wafer table:
wafer(mm) chip process(nm) die(mm^2) GH/s(per die) DpW GH/s(per wafer)
300 KnC 28 441,00 25 128 3200,00
300 bitfury 55 14,44 2 4717 9434,00
300 bfl 65 56,25 4 1167 4668,00
300 asciminer(?) 130 17,50 0,333 3877 1291,04
300 avalon 110 16,13 0,282 4214 1188,35
300 asciminer(?) 130 21,7 0,333 3112 1036,30
(DpW, die per wafer; yield percentage not taken into account)