Doesn't removing ~250W TDP from one single chip die seem like a significant engineering challenge?

What's the core voltage on that bad boy?  Sounds like you'd need to be supplying it with at least a couple hundred amps...

So lets make a giant chip that generates so much heat we need liquid cooling, nothing can go wrong  

It's not like you get lower yields and tend to run into more problems with leakage and lower roof for clock frequency or anything like that with massive chips, no no we need maximum gh/chip nothing else matters!