I'm working on an aggressive new design:
12 chips in 5x10cm, designed to work with a backplane. Onboard digital Vdd control (controllable via I2C from rpi/bbb), temp monitoring (also via I2C), overtemp Vdd shutdown. Designed to have a heatsink mounted to the back with airflow; I expect this sucker to require some cooling! 40A of Vdd current capacity allows for up to 3.3A per chip.
I'm designing the backplane system now. The initial backplane will be a bank of four of these modules, but I have grand visions of 600GH or 1.2TH miners, with windtunnel enclosures.
shouldn't you stick the edge connector near the middle of the board to stop the weight of the board trying to twist it out of the socket? Otherwise you need mounting brackets etc.
I've got mounting brackets in mind too. I'm going to 3d print pieces which will slide into t-slot extrusion, hold the lower right corner of the board, and serve as fan mounts. The whole enclosure will be made out of t-slot extrusion with acrylic side panels.