Re: [LABCOIN] IPO [BTCT.CO] - Details/FAQ and Discussion (ASIC dev/sales/mining)
If you don't think a board can work without visible traces on the top layer can you explain how the bitfury H-board actually works, when there are no visible, top-layer traces between the chips and the capacitors or anything else, except for closed loops that connect back to themselves?
My apologies if I'm wrong, it would be a good thing if I was. But the board you presented has a few things that the ones posted by Labcoin do not, such as:- Soldered chips (optional)
- Other soldered components (optional)
- Chips have traces running from their pads, visibly (optional)
- Vias visible showing the board is clearly multi-layer (optional)
- Several components around each chip (optional - could be Labcoin are super pro and don't need anything outside the chip package or they are on the other side/other board)
- An interface array of pads where power connects (required - they only show one power pin per each chip)
- An interface array of pads where the other board connects (required)
If those things are real and they work, that's quite an efficient and breakthrough design that nobody so far has made for bitcoin.
Also people asking other people to explain why some chips are missing. Are you serious? Not all trays have to be filled with chips, and the chips could be located anywhere else than that tray and a mining board, those are not the only two locations in the Universe where the (presumably) missing chips could be located.
But anyway the whole "the boards are bad that proves they're scammers!!" thing makes zero sense. Why would scammers create boards with no traces when they have $700k in IPO money to spend. You can get a PCB created in 24 hours, with any design you want, including full netlist testing to make sure all the connections on every board work fine. It would be expensive, but it's certainly something that could be done.
True. I could make a fake design, get a board, find some tray of 44 pins chips to match the board, and post some hand-shaky pictures with an old DSLR that can't clean dust off the sensor.But if I did that, there would be discrepancies between real designs and my fake design (me being incompetent at this as demonstrated by the users of this forum in reply to my posts) . Such as bad layout, unconnected pads, missing pads, missing logic connectors, oversized elements, undersized elements, non-standard design choices, that could totally blow up my fake design pictures.