You have all been waiting for an update on our chips and we can today announce that the Fabrication process has finished and the wafers are on their way to the packing assembly house right now.
Writhe trolls; rejoice investomers.
A bit early to celebrate. Pretty much nothing could have gone wrong so far, barring the TSMC fab burning down or being struck by an earthquake, once you tape out and start a wafer run, you are going to get wafers. Thats not good news, thats just a given.
But you still have no idea how these chips will pan out. They may not work at all, they may not perform as expected, there may all kinds of problems packaging them. You havent been able to test the PCBs, firmware, software, well anything really.
Given the enormous time to market pressure I cant blame these guys for hoping for the best, but there is no other industry in the world where they expect to ship to consumers less than 2 weeks after receiving their first processed wafers. For the record, it took BFL like 6 months or so?