That said we only KnC's package size, not die size. Large package size, does not necessarily correlate to a large die size.
Ill grant you that, but I havent heard anyone refute hashfast's argument that the minimum estimate of KnC's die size based on the package/underfull dimensions would be on the order of 900mm³. Thats not just a little bit bigger, thats an epic size.
Although you wouldn't conversely be able to house a large dies in a small package, but there could be many reasons behind the choice. I could try and press them on this in a few days, but if they haven't mentioned it now, I presume they will likely be more cagey this time round when they have nothing more to prove than performance figures.
Please do also ask about the PCB testing with the cyclone fpga (see my last post edit at the end). How come their "full custom" asic happens to be electrically and pin compatible with an altera cyclone IV (and therefore, hardcopy IV) if its not a hardcopy?
https://www.kncminer.com/userfiles/image/ASIC_PCB.jpg
It just doesnt seem very likely or credible to me.edit: should have read the text better.
Puppet, mate, on your link that board with the FPGA and the pen, could that have been a dev board for testing?
In the video they released the other day those quadrants no longer appear to be present?
Take a look apprx ~10 seconds in;
http://www.youtube.com/watch?v=4IdiBynh8WoI'll ask, but it makes sense, i think. I mean the board being manufactured is different.
