The package is what you see when you think of a chip.  Here is a qfp package:

http://www.toshiba-components.com/ASIC/images/QFP.jpg

CPU's and highend bitcoin asics are all bga packages, they look like this:

http://www.emeraldinsight.com/content_images/fig/2190090207005.png

The die is burried (soldered/glued) inside the package. Bad packaging means those chips are unfixable.  But the design may be fine, you can reused the mask, just need another production run (2-3 month)