Would really appreciate it if anyone getting a miner with fans knocked off in transit mark those ASIC modules some way that if later there's one or more modules with failing cores it can be noted as previously had the fan knocked off or not.

Theory: if a shock separated a solder point on the ball grid array of the ASIC module but still makes physical contact tho not flowed-solder contact, it will make a somewhat higher resistance point under current and raise temperature and that raised temperature will cause cores with gates at the hot spot to have more errors.