One thing no one has mentioned and i would like to hear opinion on.

With immersion cooling (I expect) the temperature is constant, deviating only slightly from the boiling point of the liquid.  Air is different because its low heat conductance, the more btu output the hotter the chip gets because it can't be carried away quickly.  With such high thermal densities being tested above this won't be a problem.

So what will being able to lock the chips temperature in at a cool 40C be?
(Marginally?) More efficient?
Over clocking potential?

The writeup mentions a longer timeline for large scale production but maybe a consumer device (enclosed cube) with immersion cooling is doable and possibly improves w/GH? Wishful thinking?

Also, could this rescue a gen2 design which had poor thermal properties?