Post
Topic
Board Development & Technical Discussion
Re: Modular FPGA Miner Hardware Design Development
by
O_Shovah
on 19/07/2011, 11:30:08 UTC
I've looked at some calculations, if we assume the 10A is spread out across all vias and traces, 0.3mm will handle 1/2 an amp safely, most of the pads have 2 traces supplying Vint. I have no idea how well Vint is spread out internally in the die.

To increase tolerances, we can goto a slightly thicker top layer, the only real way to test if we can continue to use 35um is probably to manufacture one test piece.

So will you do that test piece for the power supply or shall somebody else do this ?