We are pleased to announce that the fabout and bumpout milestones have both been successfully completed for the initial GoldStrike™ I wafers, and that the next two steps – wafer sorting and packaging – are underway.

Full Engineering update and pictures here:
http://cointerra.com/engineering-update-goldstrike-fabout-bumpout-completed-sorting-packaging-underway/






http://cointerra.com/engineering-update-goldstrike-fabout-bumpout-completed-sorting-packaging-underway/