Re: Klondike - 16 chip ASIC Open Source Board - Preliminary
Zipiju,
That thar is some nice looking PCB work. Just to be clear, those are Gen2, 55nm Avalon chips AND you're chasing down a short somewhere .... right??? Solder bridge shorts are a true PITA to work out. On replacing the Avalon chips, I've done tight package replacements using just a hardware store heat gun (on high). I made an aluminum foil shield to cover the components around the BGP package device I was replacing (so as not to melt their solder) and then ever so gingerly heated the part I needed to replace to a point where it would release from the board using my chip suction device. It's not quite a hot air re-flow station BUT it does the trick. To replace the part I tinned the pads on the PCB, put the part on the board, held it in place with a long rigid wire (because I didn't want to toast my fingers in the process) and again used the heat gun to re-flow the tinned pads. If don't want to pre-tin the pads and you happen to have solder paste laying around you can dab a small amount (and I mean a pin head amount) onto the device pads and then, using your chip suction device, line the device up with the PCB pads and drop it onto the board. The heat gun process applies once the part is stuck to the board. On a final note, I always part with a bit of advice. Do NOT drop that hot heat gun on your junk
. In fact, try to NEVER do electronics work wearing only a Speedo. Safety first 
On the topic of solder bridges that can happen with REALLY tight pitched electronics used on the K16S-55nm board have you considered building yourself one of these -> http://www.instructables.com/id/DIY-Soldering-Reflow-Oven/ .
I did and it makes doing tight pitch packages as ell as BGM type packages SUPER easy (using a stencil and solder paste).
H@shKraker
That thar is some nice looking PCB work. Just to be clear, those are Gen2, 55nm Avalon chips AND you're chasing down a short somewhere .... right??? Solder bridge shorts are a true PITA to work out. On replacing the Avalon chips, I've done tight package replacements using just a hardware store heat gun (on high). I made an aluminum foil shield to cover the components around the BGP package device I was replacing (so as not to melt their solder) and then ever so gingerly heated the part I needed to replace to a point where it would release from the board using my chip suction device. It's not quite a hot air re-flow station BUT it does the trick. To replace the part I tinned the pads on the PCB, put the part on the board, held it in place with a long rigid wire (because I didn't want to toast my fingers in the process) and again used the heat gun to re-flow the tinned pads. If don't want to pre-tin the pads and you happen to have solder paste laying around you can dab a small amount (and I mean a pin head amount) onto the device pads and then, using your chip suction device, line the device up with the PCB pads and drop it onto the board. The heat gun process applies once the part is stuck to the board. On a final note, I always part with a bit of advice. Do NOT drop that hot heat gun on your junk
. In fact, try to NEVER do electronics work wearing only a Speedo. Safety first On the topic of solder bridges that can happen with REALLY tight pitched electronics used on the K16S-55nm board have you considered building yourself one of these -> http://www.instructables.com/id/DIY-Soldering-Reflow-Oven/ .
I did and it makes doing tight pitch packages as ell as BGM type packages SUPER easy (using a stencil and solder paste).
H@shKraker