Radeon VII has production issues with making the die package level. This made the company have to resort to using higher end thermal pads between the die/hbm and the heatsink.  This is a good bit inferior than a properly thin layer of thermal paste, however since not all die packages were level this level of thinness couldn't be garunteed. So, in order to ensure all cards perform at least within spec, AMD used a thicker solution, a thermal pad. 

Many have modded their cards to replace the pad with paste, hoping their dies are level enough. Others are tightening the mounting screws a bit more, and of source there are water cooling plates out there now, as well as people tossing on aftermarket coolers like the morpheus II.

Add this to the stock voltages being way to high for every clockspeed, and needing a bit of external airflow over the backplate (as would be had in a well ventilated case) and it results in many ways to address cooling. Don't just have this card sitting on a testbench....it needs a bit of airflow over it.

Finally don't forget that throttling temp is based of the new tjunct value, which is the highest temp in a much dense array of sensors as compared to hot spot temp value of vega 56/64.  This difference is more about a change in measurement resolution rather than the chip actually running any hotter or cooler than last gen. As long as your tjunct isn't throttling, pay more attention to your general core temps.