Progress update - 12 Feb 2014
also posted on:
http://www.blackarrowsoftware.com/store/progress-update-12-feb-2014.htmlhttp://ecointalk.net/topic/511-progress-update-12-feb-2014/Following customer feedback we will be posting regularly updates.
12 February 2014
1. Chip pinout complete. Received for review. We have confirmed to be ok.
2. Based on Verisilicons feedback we are upgrading the heatsink to the new specs
3. Improved X3 case to optimize functionality
4. Reduced the number of PCBs in X1 from 6 to 3 to improve reliability.
5. X1 hashboard has been reworked to support higher power consumption. We are now at version 3. Layout completed, starting rerouting tomorrow.
6. X3 hashboard has been redesigned due to case improvements. Completed schematics of the 3rd version of the board. Starting layout after routing of X1 board
7. Control board has been redesigned to use PCI connector instead of flat cable for improved reliability. Layout complete, rerouting tomorrow.
8. Aquired bespoke 3D printer. Initiated prototyping of new parts for improved functionality in X3.
9. Meeting with VeriSilicon
10. Tapeout reconfirmed on 20 Feb 2014
11. Package confirmed
12. Delivered all final details regarding case, heatsinks and fans, running final thermal simulation, due to be received at the end of this week