The chip itself has an overheat threshold which is around 130's C.
And check to see if the cores in each chip are ok.
No doubt check the chips... If that is the package temp the internal die is going to substantial higher than that. Not a good thing to do. Is that temp sensed on the die itself or the chip package/bga pad area?. If it's the die, pushing things but not *too* badly if off the die... yikes.