The number one major design flaw of these high density 17 Series is the fact that soldered on the heatsinks only sound good in theory. In reality you have to bond copper to Silicon in order for the heatsinks to have something to solder onto. Things really turn to shit though when the ASIC gets hot enough so that the copper coating actually dissolves into the solder! Of course when there’s no surface to cling to anymore the heat sink simply falls off, sometimes they call this black ASIC. Once this occurs, you either have to replace the chip or use a thermal heat sink epoxy. You cannot rely on any other adhesive at these temperatures, the old Bitmain vinyl thermal set adhesive can’t do it, silicone can’t do it, etc.

I noticed some heat warnings in the log, if you have a Heatsinks hanging on by a thread they are certainly not carrying away heat like they are supposed to.