That looks like an old Intel 4004 (a 4-bit CPU, circa 1971!). The DIP packaging is old school and does not convey the future of NXT. SOIC (Small Outline IC), PLCC (plastic leaded chip carrier), QFP (Quad Flat Package), PGA (Pin grid array), QFN (quad flat no-lead package) and BGA (ball grid array) are modern SMT packages. Just a little constructive criticism.