Thanks tolip.
And maybe you could give your opinion on the statement "Core temperature sensing is performed by circuits on the die"
The LM75 measures it own case temperature.
There _IS_ a die in there though.
The original statement may have originated by someone who was wordlexic.
Die(s)/PCB/cube whatever.
I don't rely on that temp for much of anything.
I ALWAYS use the hottest temp I can find for cooling decisions.
As I type...
67C on bottom of PCB directly below ASIC
61C reported by LM75
I IR gunned the PCB temp.
I could probbably find hotter but bottom of PCB's is inside my pentagon with trapped V8 bottle.
It's tight in there and the bottle is not a cooperative captive.
http://i.imgur.com/9T8lRc2.jpg
YMMV
