--snip
I can also share that we're zeroing on the issue and it's a TSMC production issue.
Future batches (October) will meet our desired spec.
Guy
This either means the chip is designed with a slight fault, or certain production methods at TSMC caused the chip to underperform.
The comment really suggests the latter.
Guy also seems to be fairly confident that it is not a packaging issue, and that it can be fixed for future chip batches (which would be great news.)
If TSMC is at fault, spondoolies might get the new and improved mask at a discount.
If it is more a question of implementing certain requirements posed by TSMC, it should really have been corrected during (initial) tapeout.
I think that it is all speculation (Edit: I see that you added the note on the same after the initial post) until we know the facts.
Were there some SP-30 that were sold as early (July) batch? If so, they would have to be shipped by July 30 and then we would know everything.