Both of my CTA's are running extremely hot, 85 - 115 C and I am experiencing terrible hash rate. Low of 200G to a high of 1.2T.
So, it seems like some thermal paste may help address the issue.
The question I have is which type is better.....
- Liquid Pro
OR
- IC Diamond
Seems like some folks have had issues with Liquid Pro due to the conductive nature of it - but there seems to be several documented positive results.
What about IC Diamond?
Should I try IC Diamond first to be safe?
Suggestions.....
Having applied various types of thermal interface material to my chips, I have to say that it really boils more down to technique. By that I mean that if you "do it right" you should be fine with ICD or even AS5.
Make sure you clean off the old TIM very well. Also make yourself some guide pins to keep the cooling block in place as you screw it back on. I suggest 2" sharpened wood dowels (or chopsticks). Don't use too much TIM either. Definitely don't use any on the outer square metal "ring" that surrounds the 4 chips.
Last but not least, be gentle when re-torquing your hold down screws. I'm not 100% sure they even need to be screwed back in all the way. Just get them good and snug and tighten opposite screws at a time.