Update

Some details of BE300:

Process: tsmc 28nm hpc

Package: fclga (5mm x 5mm)

Normal Mode:
    0.7v vdd
    6gh/s per chip
    8gh/s-12gh/s per chip for mass production
    0.343w/g on chip
    ~0.3w/g on chip for mass production

Low Power Mode:
    0.55v vdd
    4.5gh/s per chip
    6gh/s-9gh/s per chip for mass production
    0.225w/g on chip
    ~0.2w/g on chip for mass production

The schedule of BE300 producing: First batch production will be done next Feb.