Will the BE300 boards fit into the Prisma fan/heatsink body?
The package turns from QFN to Flip-Chip-LGA, which means that
most heat dissipates to the upper side of the chip instead of PCB,
so... not very appropriate to stick to the piple-like heat dissipation
design.
FC, you can probably dispel a little confusion here. The MPW samples you have and are testing are not in the same package as the final chips will be in. The production chips will look significantly different than the test chips, and the board package will be different.
Is that correct?
Package propably will be the same. I'm quessing that die inside will be little different (more "cores").