FC, you can probably dispel a little confusion here. The MPW samples you have and are testing are not in the same package as the final chips will be in. The production chips will look significantly different than the test chips, and the board package will be different.
Is that correct?
BE200 -- QFN 8x8 or 9x9
BE300S -- FCLGA 5x5
BE300 Final Version -- FCLGA nxn (n not determined yet)
QFN in a low voltage setting introduces too much overhead, so although we wanted compatibility hard, we chose a different package.