Looks very bad.
It just proves once again that the existing cooling design is bad and needs improvement.
At the same time, if heat sinks can not be removed safely from chips, then they can probably be removed safely from the back side of the board.
According to photos, there will be a good heat transfer from the back side of the board through some thick thermal pads to water block, or even better, through some thin thermal pads to a more sophisticated water block.
The temps should go lower by 10-15 degrees allowing some overclocking or safe quiet long term operation.