Quote from: noddy2000 on April 09, 2015, 11:59:01 PM

Quote from: oldcrow on April 09, 2015, 01:35:05 AM

This article is about 3D printers, but the parallels are worth noting. Substitute pre-order for kickstarter and miner for printer and you have a very good analysis of what has happened not only here, but with other would-be miner manufacturers.

http://www.inside3dp.com/low-cost-3d-printers-crowdfunding-suicide/

--Crow
/**/

Excellent article and spot on with your point. Just the people at bfl never intended to be a 'legitimate' company in the first place, same as BA, AMT etc etc. They are just professional con men, and in bfl's case, all mentally disturbed from a military background which is the worst thing a person can do to themselves!

But indigress, thanks for the link, enjoyed that read as I myself have been many 3D printer shows and this articles answers a lot of things that I see when I go these places.

Edit: thought this was BFL thread, took a while read the article but its still relative :-)

Quote from: blackarrow on February 12, 2014, 02:30:23 PM

Progress update - 12 Feb 2014

also posted on:
http://www.blackarrowsoftware.com/store/progress-update-12-feb-2014.html
http://ecointalk.net/topic/511-progress-update-12-feb-2014/

Following customer feedback we will be posting regularly updates.

12 February 2014

1. Chip pinout complete. Received for review. We have confirmed to be ok.

2. Based on Verisilicons feedback we are upgrading the heatsink to the new specs

3. Improved X3 case to optimize functionality

4. Reduced the number of PCBs in X1 from 6 to 3 to improve reliability.

5. X1 hashboard has been reworked to support higher power consumption. We are now at version 3. Layout completed, starting rerouting tomorrow.

6. X3 hashboard has been redesigned due to case improvements. Completed schematics of the 3rd version of the board. Starting layout after routing of X1 board

7. Control board has been redesigned to use PCI connector instead of flat cable for improved reliability. Layout complete, rerouting tomorrow.
8. Aquired bespoke 3D printer. Initiated prototyping of new parts for improved functionality in X3.
9. Meeting with VeriSilicon

10. Tapeout reconfirmed on 20 Feb 2014

11. Package confirmed

12. Delivered all final details regarding case, heatsinks and fans, running final thermal simulation, due to be received at the end of this week

3D printers are right on topic for this thread.