Quote from: Sweminer777 on July 28, 2015, 07:15:33 AM

Quote from: goxed on July 27, 2015, 04:49:54 PM

Quote from: macgyver007 on July 27, 2015, 04:33:30 PM

Quote from: goxed on July 27, 2015, 04:21:07 PM

Quote from: macgyver007 on July 27, 2015, 04:16:40 PM

we must have gone to different schools

Im still waiting for you to re-paste the other 7 chips on your SP20 and post the before and after results Mr Scientist

Not before you leap down that cliff and let us know the gravitation acceleration that was measured. Wink

Some scientist you are...you should know that gravity is a constant ...want an apple to race with? Tongue

Back to topic...what were your results from before and after with your 8x as conductive as MG grease...I am very curious to know your results as you actually went through all the trouble to remove 1 whole heatsink assembly...soooo what were the results from using your super duper AS5...was it 8x cooler? any numbers at all from your clearly extensive testing to back anything up or just another lame signature spam campaign hmmmm Im done ...thanks for the laugh Roll Eyes

Glad that you found humor in this thread. Sigs are cool, and a fact on this group Wink

I do not think I compared MG thermal stuff with AS5.
All I did was remove one heatsink, took a pic, replaced the grease with AS5, screwed it back in.
The voltage on the said chip did not rise immediately to the intended level of 0.65V because the thermal gap did not close.
Then I applied epoxy adhesive and put pressure of the heatsink until the epoxy cured. It closed the thermal gap and the chip worked fine at 0.65V. Just like it did before the heatsink was removed. What I can say is that most likely AS5 has equal thermal conductivity compared to the OEM grease. 8X thermal conductivity does not imply that temps will be reduced by 8X.
(Final temps also depends on the temperature differential between chip and heatsink). I think it means that AS5 will conduct 8X the amount of heat than MG paste.

i did not remove the thermal greese from the blates between the heatsinks and the copper, i left that, as i read on some treadh that someone had a big issue whit that.

The greese looks fine ,its alot and it keeps dripping when its hot , the boards were full of greese but didnt seem to have any bad effect, i still cleaned it, i just repasted the chip between the copper plate but nothing more than that, i put just a drip as it said that the AS5 is very think and it was really consistent , i had to press abit to get some good spreading on the chips

Did you put some Epoxy glue to the heatsink in order to make it stick back to the glued in portion and not be wobbly?