Quote from: Sweminer777 on July 28, 2015, 03:18:40 PM

Quote from: goxed on July 28, 2015, 03:08:35 PM

Quote from: Sweminer777 on July 28, 2015, 01:57:26 PM

Quote from: goxed on July 28, 2015, 11:18:08 AM

Did you put some Epoxy glue to the heatsink in order to make it stick back to the glued in portion and not be wobbly?

I did not remove the copper plate from the heatsink.

I only put AS5 on the cores and it did well the job for them sticking to it.

AS5 is a non adhesive thermal compound, it does not have good adhesive properties.
There are 2 diagonally opposite screws to tighten the heatsink, ideally there should be 4, in order to apply adequate pressure and close the thermal gap.
if you are not using glue on the white spots where the heatsink was factory glued, your heatsink might not have good thermal contact with the chip.

What was your hashing rate and chip voltages before repasting?

My temps are fine on closed enviroment. is even better than before repaste. i was doing 80-85.

Dropped to 68-69 after this, i have not glued anything, it just sits whit preasure.
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