Quote from: dkaufman on September 09, 2015, 06:12:08 PM

Actually, I received a replacement hash board for my S5 recently which has the many-small heat sinks, one attached to each asic chip, and it works great, and runs a LOT cooler than the old-style cooling system, where all the chips on the board have thermal paste on top of them, and they are all in contact with one large heat sink.

So I'm sure the S7 (and S5+) need far less fan power to keep them cool, which is why they can be packaged so much more densely.

-dave

You do not have the right twice.
1. many-small heat sinks are attached not to S5 chip . And You still need the large heat sink and thermal paste for cooling chip side of hashboard.

2. S5+ need more fan power to keep them cool as S5. Almost two times more. The same tornado also be S7.