I asked specifically at which point the failure would be expected. An ignorant "HERP DERP THEY WONT DELIVER" is not a specific point.
Possible answers from someone who isn't stupid would be "the fab won't have finished all the layers in time" or "the packaging will take longer than expected" or "chips will get stuck in customs" or "functional testing will fail" or "thermal/environmental testing will fail" etc.
Possible answers from someone who isn't stupid would be "the fab won't have finished all the layers in time" or "the packaging will take longer than expected" or "chips will get stuck in customs" or "functional testing will fail" or "thermal/environmental testing will fail" etc.
That one. (In bold above.)
Agreed. If there is to be a problem, that would be the most serious.
I was largely testing the other poster
NO PROTOTYPE
How do you know there was no prototype? A prototype with major issues (eg. overheating or reliability issues) would not be something they would want to brag about or produce demos of, but they would learn what they need to produce a full run of working chips.
Um, the batch of chips that was received in December was a full-wafer run. I believe Josh mentioned 100k chips.
The ones with the major overheating and clock stability issues.
That may very well be true, and I hope for their sake that they learned everything they could from those chips if that's the case.