I'm beginning to be really curious as to what the hold up is. Proper way to do this is to plan ahead, and plan for errors also.
Has something come up?
Why was hardware ordered after chips and boards arrived?
Haven't any mechanical CAD or thermal analysis been done?
Hope your update is open and detailed. There's no need to keep any secrets at this point.
The hold up, right now, is the Chinese New Year, and possibly, your inability to read.
friedcat has already said in this thread:
1) The first batch was split in half just in case there were errors in the chip design, and the first half of the first batch has been completed, the rest of the first batch has only been manufactured half way and...
2) friedcat has given his go ahead to the chip fab to complete them
3) friedcat has tested a sample of the chips, and they passed testing with flying colors, and may even be able to be clocked much higher than originally engineered for, due to how well they came out
4) the half of the first batch has been sent to the board assembler to be surface mounted with the rest of the components
5) the Chinese New Year means nothing gets done
6) he has already chosen and mostly prepared the location the mining rigs will be setup
7) the first boards should be completed and sent to friedcat and begin mining in the first or second week of February
1. According to friedcat the 2nd half was finished and in QC over a week ago
2. The go ahead was given and additional wafers were ordered, not the first 12
3.
4.
5. Nowhere has friedcat said that Chinese New Year would in any way influence ASICMINER. He said and I quote: It might take more than 2 weeks to get all 12 wafers up and hashing
6.
7. See 5. I read his update that all chips from the 12 wafers would be up and running in appr 2 weeks since the last update, so 1 week from now.
The only thing of concern and possibly related to CNY is the act that they ordered Heatsinks in bulk 2 weeks ago.... That might cause a delay if they dont arrive before CNY