Hi Guys,
I'm an electronics HW design engineer with around 10years exp. The company I work for has designed mil spec electronics HW including mil spec ASICs.
Prototype ASICs are usually epoxy encased. The picture could be showing a BGA type Epoxy encased ASIC, hence the rounded side. BGA devices have the pins at the bottom.
Plastic encapsulation, with sharp square edges, doesn't occur until mass production.
TH components are commonly used throughout the prototype stage. The switch to Full SMD design happens later during mass production.
The TH components near the pictured ASICs could be, as mentioned before... micro-controller based ICs.
Just my 2 cents.
I'm an electronics HW design engineer with around 10years exp. The company I work for has designed mil spec electronics HW including mil spec ASICs.
Prototype ASICs are usually epoxy encased. The picture could be showing a BGA type Epoxy encased ASIC, hence the rounded side. BGA devices have the pins at the bottom.
Plastic encapsulation, with sharp square edges, doesn't occur until mass production.
TH components are commonly used throughout the prototype stage. The switch to Full SMD design happens later during mass production.
The TH components near the pictured ASICs could be, as mentioned before... micro-controller based ICs.
Just my 2 cents.
Guys THIS IS A SCAM !!!
After examining the PCB in more detail, i have concluded this is a SCAM.
After examining the PCB in more detail, i have concluded this is a SCAM.
ub3rCoin, TELL US WHY YOUR POINT OF VIEW HAS CHANGED...
In the left image with the ASICs, the rightmost chip covers the white silkscreen line about halfway between the SMT components in the red circle and the end of the white silkscreen rectangle. Look at the same silkscreen line in the right image, ironically title "proof.jpg". You can see the line extends past the SMT components in that picture, unobstructed by an "ASIC".