I think it is a big, big mistake to:
use a big die
OR
use a big package
OR
use a multi-die package
How do I/we talk some sense into them?!??
I agree. @Bitcoinorama, (or anyone else) is there a way we can get more details on the die size, packaging method[1], type[2] and size?
[1] - multi-chip vs. single, flipchip vs. wirebond,
[2] - BGA, LGA, or board to board